| Order Quantity |
≥1 PC |
| Quality Standard |
IPC-A-610 |
| Assembly Service |
Turnkey (Full Component Sourcing) / Partial Turnkey / Consignment
Assembly
|
| Assembly Type |
Surface Mount Technology (SMT), Through-Hole (DIP), Mixed Technology (SMT +
THT)
|
| File Formats |
BOM (Bill of Materials), PCB files (Gerber or most PCB design
formats), Pick & Place file, Centroid file
|
| Lead Time |
24-hour express service available. PCBA prototype orders usually take 3–4 days.
Exact delivery time will be provided in the quotation.
|
| Board size |
Minimum size: 50mm*30mm |
|
Maximum sizes:
Standard board: 360mm*410mm (14"*16");
Special board: 510mm*750mm (20"*29")
|
| Board Thickness |
0.3–6 mm |
| PCB Types |
Rigid PCB, Flexible PCB, Metal Core PCB |
| Surface Finish |
Leaded / Lead-Free HASL, ENIG, OSP |
| Accepted SMD Packages |
01005, 0201, 0402, BGA, QFP, QFN, TSOP, CSP, Long Connectors |
| Component Size Range |
01005 – 54 mm² |
| BGA Ball Size |
0.1 – 0.63 mm |
| Minimum BGA Pitch |
0.20 mm |
| Minimum Package |
01005 (0.4 × 0.2 mm) |
| Placement Accuracy |
±0.035 mm |
| Minimum QFP Lead Pitch |
0.35 mm |
| Pick & Place Precision |
±0.01 mm |
| Placement Capability |
01005, 0201, 0402, 0603, 0805 and larger |
| SMT Daily Capacity |
8 million placements per day |
| THT Insertion Capacity |
100,000 components/day |
| Component Height |
0.2 – 25 mm |
| Maximum PCB Width |
450 mm |
| Lead-Free Process |
Lead-free wave soldering supported |
| Cable Assembly |
Custom cable and wire harness assembly for industries such as
automotive, security, mining, medical, and entertainment
|
| Repair & Rework |
Professional BGA rework services for removing and re-soldering misaligned,
defective, or cold-soldered BGAs
|
| Solder Materials |
Lead-free (RoHS compliant) solder paste, solder wire, and solder bar
available; custom alloy compositions available upon request
|
| Stencil |
Laser-cut stainless steel stencils used to ensure fine-pitch IC and BGA assembly
meeting IPC Class 2 or higher
|
| Component Packaging |
SMT Components: Reel, cut tape, tube, and tray packaging accepted
Through-Hole
Components: Bulk packaging accepted
|
| test |
• IPQC: In-process inspection, first article LCR test.
|
|
• IQC: Incoming Quality Control.
|
|
• Visual QC: Routine quality inspection.
|
|
• SPI Inspection: Solder Paste Inspection.
|
|
• AOI: Automated Optical Inspection for soldering quality, missing components,
and polarity errors.
|
|
• X-Ray: Inspection for hidden solder joints such as BGA and QFN.
|
|
• Functional testing: Functional and performance testing based on customer test
procedures.
|
