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Materials
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High Tg FR4 (halogen-free)
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Shengyi S1165, Jiantao HF-170
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Standard Tg FR4 (halogen-free)
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Shengyi S1155, Kingboard HF-170
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High CTI
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Shengyi S1600L, KB6165GC, KB-6169GT
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High Tg FR4
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FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, S1000-2M, IT180A, IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron 6/7/8 (Panasonic); EM-827(Taikwang)；GA-170 (Macro N)； NP-180 (Nan Ya); TU-752, TU-662(TUC);
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Standard FR4
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Shengyi S1141,S1000H\ ITEQ IT158\Kingboard KB-6160, KB-6165
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High frequency/high speed
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Rogers, Shengyi, Taiyao, Taiguang, Lianmao, Taizhou Wangling, Taconic
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Substrate
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Min Finished Hole Diameter & Tolerance
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NPTH: 0.5±0.05mm; PTH: 1.0±0.10mm
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Machining Dimensional Accuracy (including blind slot depth control)
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±0.1mm
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PCB Surface Finish
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Leaded / Lead-free HASL, OSP, ENIG / ENEPIG, Electroplated Ni/Au (Soft Gold /
Hard Gold), Electroplated Tin
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Metal Surface Finish
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Mechanical Finish: sandblasting, wire drawing, and other chemical surface
treatments
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Metal Core Materials
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Teng Hui, Bergs, Hezheng, Lianmao, Shengyi, Nanya, Jiantao
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Thermal Conductive Dielectric Thickness
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75/100/125/150/200/250um
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Thermal Conductivity
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386-401W/(MK)
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Copper substrate type
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Mixed pressing, sandwich
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Structure Type
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Standard Structures
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Multi-layer buried blind vias, thick copper power supply, stepped grooves,
countersunk holes, POFV, depth control, through-type multi-layer soldering rings
(hole insulation), thermoelectric separation
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Blind/Buried via board
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Pressing the same surface ≤ 3 times
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Surface Finish
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Surface Finish type
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HASL with lead , HASL lead free ，Plated Ni/Au (Base Copper Thickness ≤2 oz)，ENIG, Immersion Tin， Immersion Silver(Ag), OSP, Hard Gold，Plated Soft Gold, ENIG + OSP, ENEPIG, EPIG
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HASL
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0.4 µm leaded HASL on large solder pads, 1.5 µm HASL lead-free on large solder pads
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Pattern Plated Cu/Ni/Au
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Nickel thickness: ≥3μm; Gold thickness: 0.025-0.1μm
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ENIG
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Nickel thickness: 3-8μm; Gold thickness: 0.025-0.075μm
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Immersion Tin
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0.8-1.5μm
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Electroplated Tin
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2-10μm
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Immersion Silver
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0.1-0.4μm
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Electroplated Silver
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0.1-5μm
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OSP
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0.2-0.4μm
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Hard gold plating (including cobalt)
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0.05-4.0μm
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Plated Soft Gold
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0.05-2.0μm
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ENEPIG
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Nickel: 3-8μm; Palladium: 0.05-0.15μm; Gold: 0.05-0.1μm
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EPIG
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Palladium: 0.05-0.15μm; Gold: 0.05-0.1μm
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Solder mask thickness
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Carbon mask
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8-20um
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Solder Mask
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10-18um (copper surface capping ink), 5-8um (via capping ink), 25um at circuit
corners (one-time printing, copper thickness below 48um)
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Blue Tape
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0.20--0.80mm
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Standard Holes
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Mechanical hole diameter (finished)
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0.125-6.5mm (corresponding drill bit diameter is 0.15-6.5mm)
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A. PTFE material and mixing process: minimum finished hole diameter 0.2mm
(corresponding drill bit 0.25mm)
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B. Mechanically buried blind hole diameter ≤ 0.30mm (corresponding drill bit ≤
0.40mm)
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C. The diameter of the hole for the green oil plug in the pan should be ≤0.55mm
(corresponding to a 0.6mm drill bit)
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D. Minimum hole diameter: 0.35mm (corresponding to a 0.4mm drill bit)
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E. Minimum finished metallized half-hole diameter: 0.30mm (corresponding to a
0.35mm drill bit)
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Minimum Track/Spacing for PTH Layer
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3/3 mil (line to line); 3/3 mil (line to disk, disk to disk)
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Lamination Cycles for PTH Layer
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≤3 times
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Drill-to-Board Thickness Ratio
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Maximum thickness-to-diameter ratio for plated through-hole (PTH): 20:1 (when
the cutter diameter is ≥ 0.15mm)
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Hole Position Tolerance (vs CAD Data)
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±2.5mil
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PTH Hole Diameter Tolerance
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±3mil
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Press-fit Hole Diameter
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±2mil
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NPTH Hole Diameter Tolerance
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±2mil (limits +0/-2mil or +2/-0mil)
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Finished Resin-Filled Hole Size
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0.1-0.9mm (corresponding to a drilling diameter of 0.15-1.0mm) (for drill holes
> 0.6mm, the board thickness must be ≥ 0.5mm)
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Maximum Aspect Ratio of Resin-Filled Hole(Plate thickness/Drilling)
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20:1
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Minimum Track/Spacing of Resin-Filled Hole
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3/4 mil (line to line); 3/3.5 mil (line to disk, disk to disk)
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Maximum Depth-to-Diameter Ratio (Blind Hole, Mechanical Drill)
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1.3:1 (aperture ≤ 0.20 mm), 1.15:1 (aperture ≥ 0.25 mm)
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Minimum Depth for Mechanical Back Drill
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0.1mm
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Back drill hole diameter
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0.4-6.5mm
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Tooling Type
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Special drill bits: 82°, 90°, 120°, 135° (tapered hole drill bit diameter range
0.3-10mm)
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Tapered / Stepped Hole Angle & Diameter
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Standard drill bits: Angle 130° (drill diameter ≤ 3.175mm), Angle165° (drill
diameter 3.175-6.3mm)
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Stepped / Tapered Hole Angle Tolerance
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±10°
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Stepped / Tapered Hole Opening Diameter Tolerance
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±0.15mm
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Stepped / Tapered Hole Depth Tolerance
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±0.10mm
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Irregular Slot Tolerance (Routing)
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±0.10mm
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Controlled Depth Routing Accuracy (NPTH)
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±0.10mm
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Minimum Tolerance for Drilled Slots
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NPTH slot: when slot length/width ≥2, tolerance ±0.05 mm (both length & width);
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PTH slot: when slot length/width ≥2, tolerance ±0.075 mm; when 1.5 ≤ slot
length/width <2, tolerance ±0.10 mm
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Minimum Tolerance for Routed Slots
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NPTH: ±0.10 mm (slot width & length); PTH: ±0.13 mm (slot width & length)
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Minimum Pad Size (Inner / Outer Layers) for Laser Vias
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10 mil (for 4 mil laser via), 11 mil (for 5 mil laser via)
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Minimum Pad Size (Inner / Outer Layers) for Mechanical Vias
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14mil (8mil drilling)
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Pad (Annular Ring)
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Minimum BGA Pad Diameter
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6mil
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Pad Diameter Tolerance
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±0.05mm
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Trace Width/Spacing
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Internal layer
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1oz: 3/4 mil
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2oz: 4/5 mil
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3oz: 5/8 mil
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4oz: 6.5/11 mil
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5oz: 7/13.5 mil
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6oz: 8/15.5 mil
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7oz: 9/18 mil
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8oz: 10/21mil
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External layer
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1/3 oz: 2.5/3 mil
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1/2 oz: 3.0/3.0 mil
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1oz: 3.5/3.5 mil
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2oz: 6/7 mil
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3oz: 7/10 mil
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4oz: 8/13 mil
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5oz: 9/15.5 mil
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6oz: 10/18.5 mil
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7oz: 11/22 mil
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8oz: 12/26 mil
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Spacing Design
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Minimum Distance from Mechanical Drill to Conductor (Non Blind/Buried Via &
1st-order Laser HDI)
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5.5mil (≤8 layers), 6.5mil (10-14 layers), 7mil (>14 layers)
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Minimum Distance from Routed Board Edge to Outer Layer Trace (No Copper
Exposure)
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8mil
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V-CUT Center Line(No Copper Exposure) to Inner/Outer Layer Circuit (H = Board
Thickness)
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1.0< H ≤1.6mm: 0.36mm(20°), 0.4mm(30°), 0.5mm(45°)
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1.6< H ≤2.4mm: 0.42mm(20°), 0.51mm(30°), 0.64mm(45°)
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2.4≤H≤3.0mm: 0.47mm(20°), 0.59mm(30°), 0.77mm(45°)
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Minimum Inner Layer Isolation Strip Width
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8mil
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Minimum Distance from Routed Board Edge to Inner Layer Trace (No Copper
Exposure)
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10mil
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Minimum Distance from Gold Finger Chamfer to TAB
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6mm
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Minimum Spacing between Vias of Same Net
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6mil (through hole), 8mil (mechanical blind via)
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Minimum Spacing between Vias of Different Nets
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12mil
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Minimum Pad Spacing (ENEPIG)
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3.5mil (corresponding to base copper of 12μm and 18μm)
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Minimum Spacing Between Gold Fingers
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5mil
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Minimum Spacing for HASL Pads (Without Solder Mask)
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7mil (10mil isolation between large copper pads)
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Minimum Clearance Between Blue Blue Tape and Pads
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14mil
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Minimum Clearance Between Silkscreen and Pads
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5mil (silk screen printing), 4mil (printing process)
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Minimum Clearance Between Carbon Mask Areas
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13mil
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Basic Parameters
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Layer counts
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1-8 Layers
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Finished product size
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MAX: 600*500mm, MIN: 5*5mm
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Finished plate thickness
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0.45-7.0mm
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Copper thickness
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0.5-10oz
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Metal base thickness
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0.3-5.0mm
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Metal base materials
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Copper, Pure iron, stainless steel
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Minimum thickness of inner layer
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0.05mm (non-buried blind hole plate), 0.13mm (buried blind hole drilling)
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Layer counts
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1-8 Layers
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Board thickness
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0.2-7.0mm
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Minimum finished product size
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2*2mm
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Maximum finished product size
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≤2 layers: 26*45 inches; ≥3 layers: 25.5*38 inches
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Interlayer alignment
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≤4mil (8 floors or less)
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Board thickness tolerance
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Plate thickness≤1.0mm:±0.1mm
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Plate thickness > 1.0mm:±10%
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Special tolerances for slab thickness (no interlayer structural requirements):
≤2.0mm slabs: ±0.1mm; 2.1-3.0mm slabs: ±0.15mm; 3.1-7.0mm slabs: +/-0.25mm.
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Impedance tolerance
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Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) (limiting capability, ±5% (≥50Ω));
Differential: ±5Ω (≤50Ω), ±10% (>50Ω) (limiting capability, ±5%)
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Forming Design Parameters
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Outline Dimension Tolerance
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±0.05mm
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Outline Position Tolerance
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0.075mm
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Maximum Warpage Capability
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0.75%
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Maximum Finished Copper Thickness (Inner/Outer Layers)
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Inner layer: 10oz; Outer layer: 10oz
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Minimum Insulation Thickness
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2mil
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Minimum Silkscreen Tracking & Height
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Linewidth 4mil, height 23mil (12um, 18um base copper); Linewidth 5mil, height
30mil (35um base copper); Linewidth 6mil, height 45mil (70um base copper)
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Minimum Inner Corner Radius
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0.3mm
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V-CUT Angle Tolerance
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±5°
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V-CUT symmetry tolerance
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±4mil
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V-CUT residual thickness tolerance
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±4mil
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V-CUT board thickness
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Substrates thickness (excluding outer copper) ≥ 0.4mm, the finished board
thickness ≤ 3.2mm. Substrates thickness ≤ 0.6mm, single-sided V-cut is
preferred.
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PCB Forming Method
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Milling the outline; V-cut; bridging; stamp perforation
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Gold finger chamfer angle tolerance
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±5°
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Gold finger chamfer thickness tolerance
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±5mil
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Solder Mask Design Parameters
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Minimum Solder Mask Bridge Width
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When the base copper is ≤1oz: 4mil (green); 5mil (other colors); 6mil (solder
mask bridge on large copper surface)
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When the bottom copper is 2-4 oz: 20mil;
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Minimum Solder Mask Opening (Single Side)
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2mil (1.5mil allowed in some areas)
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Minimum Distance from Solder Mask Opening to Trace
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3mil
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Minimum Solder Mask Clearance to Non-Plated Hole
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6mil
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Solder Mask Colors
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Green (matte), Yellow, Black (matte), Blue, Red, White, Purple, Transparent,
Gray
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Silkscreen Colors
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White, Yellow, Black
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Test parameters
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Minimum Continuity Test Resistance
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10Ω
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Maximum Insulation Resistance
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100 MΩ
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Maximum test voltage
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300V
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