| Materials |
HDI board material type |
RCC (65T & 100T), LDPP (IT-180A 1037 and 1086), and ordinary PP 106
and 1080
|
| High Tg FR-4 (halogen-free) |
Shengyi S1165, Jiantao HF-170 |
| Standard Tg FR-4 (halogen-free) |
Shengyi S1155, KB-6165G |
| High CTI |
Shengyi S1600L, KB6165GC, KB-6169GT |
| High Tg FR-4 |
FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, S1000-2M, IT180A, IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron 6/7/8 (Panasonic); EM-827(Taikwang)；GA-170 (Macro N)； NP-180 (Nan Ya); TU-752, TU-662(TUC);
|
| Standard FR-4 |
Shengyi S1141,S1000H\ ITEQ IT158\Kingboard KB-6160, KB-6165 |
| Ceramic-Filled High-Frequency Materials |
Rogers 4 series (RO4350B, RO4003, RO4725, RO4730), Shengyi (SJ9033,
SJ9036)
|
| Ceramic prepreg |
RO4450F/F, SJ930B, SJ936B |
| PTFE High-Frequency Materials |
Rogers (Arlon) series, Taconic series, Taizhou Wangling F4BM/TP
series, Shengyi, Guoneng, Ruilong, Zhongying, Jinyao
|
| PTFE prepreg |
Rogers 6700, Taconic FR-28, RT6002 |
| Hybrid Lamination |
Rogers (Arlon), Taconic, Nelco, Shengyi SJ and FR-4 (containing
RO4350 partial mixing)
|
| Structure Type |
Standard Structures |
Backplane, multi-layer buried blind vias, embedded/buried copper blocks, power
supply thick copper, back drilling, stepped grooves, metal edging, countersunk
holes, POFV, controlled depth drilling, crimp holes, stepped plates
|
| Blind/Buried Via Board Types |
Pressing the same surface ≤ 3 times |
| Surface Finish |
Surface Finish Type |
HASL with lead , HASL lead free ，Plated Ni/Au (Base Copper Thickness ≤2 oz)，ENIG, Immersion Tin， Immersion Silver(Ag), OSP, Hard Gold，Plated Soft Gold, ENIG + OSP, ENEPIG, EPIG
|
| HASL |
0.4 µm leaded HASL on large solder pads, 1.5 µm HASL lead-free on large solder pads |
| Pattern Plated Cu/Ni/Au |
Nickel thickness: ≥3μm; Gold thickness: 0.025-0.1μm |
| ENIG |
Nickel thickness: 3-8μm; Gold thickness: 0.025-0.075μm |
| Immersion Tin |
0.8-1.5μm |
| Electroplated Tin |
2-10μm |
| Immersion Silver |
0.1-0.4μm |
| Electroplated Silver |
0.1-5μm |
| OSP |
0.2-0.4μm |
| Hard Gold(with cobalt) |
0.05-4.0μm |
| Plated Soft Gold |
0.05-2.0μm |
| ENEPIG |
Nickel: 3-8μm; Palladium: 0.05-0.15μm; Gold: 0.05-0.1μm |
| EPIG |
Palladium: 0.05-0.15μm; Gold: 0.05-0.1μm |
| Solder Mask Thickness |
Carbon mask |
8-20um |
| Solder Mask |
10-18um (copper surface capping ink), 5-8um (via capping ink), ≥5um at circuit
corners (one-time printing, copper thickness below 48um)
|
| Blue Tape |
0.20--0.80mm |
| Standard Holes |
Mechanical hole diameter (finished) |
0.125-6.5mm (corresponding drill bit diameter is 0.15-6.5mm)
|
|
A. PTFE material and mixing process: minimum finished hole diameter 0.2mm
(corresponding drill bit 0.25mm)
|
|
B. Mechanically buried blind hole diameter ≤ 0.30mm (corresponding drill bit ≤
0.40mm)
|
|
C. The diameter of the hole for the green oil plug in the pan should be ≤0.55mm
(corresponding to a 0.6mm drill bit).
|
|
D. Minimum hole diameter: 0.35mm (corresponding to a 0.4mm drill bit)
|
|
E. Minimum finished metallized half-hole diameter: 0.30mm (corresponding to a
0.35mm drill bit)
|
| Minimum Track/Spacing for PTH Layer |
3/3 mil (line to line); 3/3 mil (line to disk, disk to disk) |
| Lamination Cycles for PTH Layer |
≤3 times |
| Drill-to-Board Thickness Ratio |
Maximum thickness-to-diameter ratio for plated through-hole (PTH):
20:1 (when the cutter diameter is ≥ 0.15mm)
|
| Hole Position Tolerance (vs CAD Data) |
±2.5mil |
| PTH Hole Diameter Tolerance |
±3mil |
| Press-fit Hole Diameter |
±2mil |
| NPTH Hole Diameter Tolerance |
±2mil (limits +0/-2mil or +2/-0mil) |
| Finished Resin-Filled Hole Size |
0.1-0.9mm (corresponding to a drilling depth of 0.15-1.0mm) |
|
Maximum Aspect Ratio of Resin-Filled Hole(Plate thickness/Drilling)
|
20:1 |
| Minimum Track/Spacing of Resin-Filled Hole |
3/4 mil (line to line); 3/3.5 mil (line to disk, disk to disk) |
| Maximum Aspect Ratio of Through Hole |
20:1 |
| Max Depth-to-Diameter Ratio (Blind Hole, Mechanical Drill) |
1.3:1 (aperture ≤ 0.20 mm), 1.15:1 (aperture ≥ 0.25 mm) |
| Minimum Depth for Mechanical Back Drill |
0.1mm |
| Back Drill Hole Diameter |
0.4-6.5mm |
|
Dielectric Thickness from Target Layer to Adjacent
Layer (Back Drilling)
|
Interlayer Dielectric Thickness for Back Drilling |
≥0.15mm |
| Back drill depth accuracy tolerance |
±0.075mm |
| Irregularly-shaped hole |
Tooling Type |
Special drill bits: 82°, 90°, 120°, 135° (tapered hole drill bit
diameter range 0.3-10mm)
|
| Tapered / Stepped Hole Angle & Diameter |
Standard drill bits: Angle 130° (drill diameter ≤ 3.175mm), Angle165° (drill
diameter 3.175-6.3mm)
|
| Stepped / Tapered Hole Angle Tolerance |
±10° |
| Stepped / Tapered Hole Opening Diameter Tolerance |
±0.15mm |
| Stepped / Tapered Hole Depth Tolerance |
±0.10mm |
| Irregular Slot Tolerance (Routing) |
±0.10mm |
| Controlled Depth Routing Accuracy (NPTH) |
±0.10mm |
| Minimum Tolerance for Drilled Slots |
NPTH slot: when slot length/width ≥2, tolerance ±0.05 mm (both length &
width);
|
|
PTH slot: when slot length/width ≥2, tolerance ±0.075 mm; when 1.5 ≤
slot length/width <2, tolerance ±0.10 mm
|
| Minimum Tolerance for Routed Slots |
NPTH: ±0.10 mm (slot width & length); PTH: ±0.13 mm (slot width & length) |
|
Minimum Pad Size (Inner / Outer Layers) for Laser Vias
|
10 mil (for 4 mil laser via), 11 mil (for 5 mil laser via)
|
|
Minimum Pad Size (Inner / Outer Layers) for Mechanical Vias
|
14 mil (for 8 mil drill)
|
| Pad (Annular Ring) |
Minimum BGA Pad Diameter |
6mil |
| Pad Diameter Tolerance |
±0.05mm |
| Trace Width/Space |
Inner layer |
1/3oz, 1/2oz: 2.5/3.0 mil |
| 1oz: 3/4 mil |
| 2oz: 4/5 mil |
| 3oz: 5/8 mil |
| 4oz: 6.5/11 mil |
| 5oz: 7/13.5 mil |
| 6oz: 8/15.5 mil |
| 7oz: 9/18 mil |
| outer layer |
1/3oz: 2.5/3 mil |
| 1/2oz: 3.0/3.0 mil |
| 1oz: 3.5/3.5 mil |
| 2oz: 6/7 mil |
| 3oz: 7/10 mil |
| 4oz: 8/13 mil |
| 5oz: 9/15.5 mil |
| 6oz: 10/18.5 mil |
| 7oz: 11/22 mil |
| 8oz: 12/26 mil |
| Spacing Design |
Minimum Distance from Mechanical Drill to Conductor (Non Blind/Buried Via &
1st-order Laser HDI)
|
5.5mil(≤8层),6.5mil(10-14层),7mil(>14层) |
|
Minimum Distance from Routed Board Edge to Outer Layer Trace (No
Copper Exposure)
|
8mil |
|
V-CUT Center Line(No Copper Exposure) to Inner/Outer Layer Circuit
(H = Board
Thickness)
|
1.0 < H ≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°)
|
|
1.6< H ≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°)
|
|
2.4≤H≤3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°)
|
| Minimum Inner Layer Isolation Strip Width |
8mil |
|
Minimum Distance from Routed Board Edge to Inner Layer Trace (No Copper
Exposure)
|
10mil |
| Minimum Distance from Gold Finger Chamfer to TAB |
6mm |
| Minimum Spacing between Vias of Same Net |
6mil (through hole), 8mil (mechanical blind via) |
| Minimum Spacing between Vias of Different Nets |
12mil |
| Minimum Pad Spacing (ENEPIG) |
3.5mil (corresponding to base copper of 12um and 18um)
|
|
Minimum Spacing Between Gold Fingers
|
5mil
|
| Minimum Spacing for HASL Pads (Without Solder Mask) |
7mil (10mil isolation between large copper pads) |
|
Minimum Clearance Between Blue Blue Tape and Pads
|
14mil
|
|
Minimum Clearance Between Silkscreen and Pads
|
5mil (silk screen printing), 4mil (printing process)
|
|
Minimum Clearance Between Carbon Mask Areas
|
13mil
|
| Ceramic Substrate Design |
Layer Count |
1~2 Layers |
| Finished Size Range |
Max: 140 x 140 mm; Min: 5 x 5 mm |
| Metal Surface Finishes |
OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG, EPIG |
| Ceramic Dielectric Thickness |
0.2 / 0.25 / 0.3 / 0.381 / 0.5 / 0.635 / 0.8 / 1.0 / 1.2 / 1.5 mm
|
| Copper Thickness
| 35 μm, 60 μm, ≥150 μm
|
|
Ceramic Materials
|
LTCC, HTCC, DBC, DPC (AlN, Al₂O₃)
|
|
Thermal Conductivity
|
24–220 W/m·K
|
| Embedded / Buried Copper Block PCB Design |
Copper Block Size
|
3*3mm-70*80mm
|
|
Copper Block Height Tolerance
|
±25um
|
|
Minimum Distance from Copper Block to Hole Wall
|
≥12mil
|
|
Embedded / Buried Copper Block Thickness
|
0.3-3.0mm
|
| High-precision PCB Basic Parameters |
Minimum thickness of inner layer |
0.05mm (non-buried blind hole plate), 0.13mm (buried blind hole drilling) |
| Layer Count |
1-40 Layers |
| Board Thickness |
0.2-7.0mm |
| Minimum finished product size |
2*2mm |
| Maximum finished product size |
Single-sided PCB and double-sided PCB: 600*1200mm Multilayer PCB: 560*1150mm
|
| Interlayer alignment |
≤4mil (8 floors or less) |
|
Board thickness tolerance
|
Board thickness≤1.0mm:±0.1mm
|
|
Board thickness＞1.0mm:±10%
|
|
Special Board Thickness Tolerance (no layer structure constraints): ≤2.0mm
slabs: ±0.1mm; 2.1-3.0mm slabs: ±0.15mm; 3.1-7.0mm slabs: +/-0.25mm.
|
| Forming Design Parameters |
Impedance tolerance |
Single-ended: ±5Ω; Differential: ±5Ω |
|
Outline Dimension Tolerance
|
±0.05mm
|
| Outline Position Tolerance |
0.075mm |
| Maximum Warpage Capability |
0.50% |
| Maximum Finished Copper Thickness (Inner/Outer Layers) |
Inner layer: 10oz; Outer layer: 20oz |
| Minimum Insulation Thickness |
2mil |
| Minimum Silkscreen Track & Height |
4 mil width / 23 mil height (12 μm, 18 μm base copper)
5 mil width / 30 mil
height (35 μm base copper)
6 mil width / 45 mil height (70 μm base copper)
|
| Minimum Internal Corner Radius |
0.3mm |
| V-CUT Angle Tolerance |
±5° |
| V-CUT symmetry tolerance |
±4mil |
| V-CUT residual thickness tolerance |
±4mil |
| V-CUT board thickness |
For substrates with a thickness (excluding outer copper) ≥ 0.4mm, the
finished board thickness ≤ 3.2mm. For substrates with a thickness ≤ 0.6mm,
single-sided V-cut is preferred.
|
|
PCB Forming Method
|
Milling the outline; V-cut; bridging; stamp perforation
|
|
Gold finger chamfer angle tolerance
|
±5°
|
|
Gold finger chamfer thickness tolerance
|
±5mil
|
| Solder Mask Design Parameters |
Minimum Solder Mask Bridge Width |
Base copper ≤1 oz: 4 mil (green), 5 mil (other colors), 6 mil (over
large copper areas)
|
| Base copper 2-4 oz: 20 mil |
| Minimum Solder Mask Opening (Single Side) |
2 mil (local minimum 1.5 mil allowed) |
| Minimum Distance from Solder Mask Opening to Trace |
3 mil |
| Minimum Solder Mask Clearance to Non-Plated Hole |
6mil |
| Solder Mask Colors |
Green (matte), Yellow, Black (matte), Blue, Red, White, Purple, Transparent,
Gray
|
| Silkscreen Colors |
White, Yellow, Black |
| Test parameters |
Minimum Continuity Test Resistance |
10Ω (Four-wire test: 0.3mΩ) |
| Maximum Insulation Resistance |
100 MΩ |
| Maximum test voltage |
300V |
