| Number of Layers: | 1-40 layers |
| Board Thickness: | 0.2mm-4.0mm |
| Pattern Width/Spacing: | 3/3mil--20/20mil |
| Through-hole Diameter: | 0.15mm--0.8mm |
| Edge Through-hole Diameter: | ≥ 0.6mm |
| Non-Through-hole Diameter: | ≥ 0.8mm |
| Clearance from NTH to Trace: | ≥ 0.2mm |
| Through-hole Copper Plating Thickness: | ≥18um |
| Spacing between Silk Screen and Solder Mask: | ≥ 0.1mm |
| V-cut Line Length: | ≥ 75mm |
| V-cut Spacing: | ≥ 3.5mm |
| Slit Width: | ≥ 0.8mm |
| Slit Gap: | ≥ 2.0mm |
| Connection Width: | ≥ 1.6mm |