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Materials
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base materials
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RCC (65T & 100T), LDPP (IT-180A 1037 and 1086), and ordinary PP 106 and 1080
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High Tg FR-4 (halogen-free)
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Shengyi S1165, Kingboard HF-170
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Standard Tg FR-4 (halogen-free)
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Shengyi S1155, KB-6165G
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High CTI
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Shengyi S1600L, KB6165GC, KB-6169GT
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High Tg FR-4
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FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, S1000-2M, IT180A,
IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron
6/7/8 (Panasonic); EM-827(Taikwang)；GA-170 (Macro N)； NP-180 (Nan Ya); TU-752, TU-662(TUC);
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Standard FR-4
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Shengyi S1141,S1000H\ ITEQ IT158\Kingboard KB-6160, KB-6165
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Structure Type
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Standard Structures
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Backplane, Multilayer buried and blind vias, Embedded/buried copper coin, Heavy
copper power supply, Back drilling, Stepped slot, Edge plating,
Countersinks/Counterbores, POFV, Z-axis milling, Press-fit hole, Stepped board
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Blind/Buried Via Board Types
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Pressing the same surface ≤ 3 times
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Surface Finish
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Surface Finish type
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HASL with lead , HASL lead free ，Plated Ni/Au (Base Copper Thickness ≤2 oz)，ENIG, Immersion Tin， Immersion Silver(Ag), OSP, Hard Gold，Plated Soft Gold, ENIG + OSP, ENEPIG, EPIG
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HASL
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0.4 µm leaded HASL on large solder pads, 1.5 µm HASL lead-free on large solder pads
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ENIG
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Nickel thickness: 3-8µm; Gold thickness: 0.025-0.075µm
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Immersion Tin
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0.8-1.5um
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Immersion Silver
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0.1-0.4um
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OSP
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0.2-0.4um
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Hard Gold(with cobalt)
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0.05-4.0um
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Plated Soft Gold
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0.05-2.0um
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ENEPIG
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Nickel: 3-8µm; Palladium: 0.05-0.15µm; Gold: 0.05-0.1µm
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EPIG
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Palladium: 0.05-0.15µm; Gold: 0.05-0.1µm
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Solder mask thickness
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Carbon Mask
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8-20um
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Solder Mask
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10-18um (copper surface capping ink), 5-8um (via capping ink), ≥5um at circuit
corners (one-time printing, copper thickness below 48um)
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Blue Tape
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8-20um
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通常穴
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Mechanical hole diameter (finished)
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0.125-6.5mm (corresponding drill bit diameter is 0.15-6.5mm)
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A. PTFE material and mixing process: minimum finished hole diameter 0.2mm
(corresponding drill bit 0.25mm)
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B. Mechanically buried blind hole diameter ≤ 0.30mm (corresponding drill bit ≤
0.40mm)
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C. The diameter of vias for solder mask plugging shall be ≤ 0.55 mm
(corresponding to a 0.6 mm drill bit).
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D. Minimum hole diameter: 0.35mm (corresponding to a 0.4mm drill bit)
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E. Minimum finished metallized Half-cut Holes diameter: 0.30mm (corresponding to
a 0.35mm drill bit)
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Track/Spacing for PTH Layer
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3/3 mil (line to line); 3/3 mil (line to pad, pad to pad)
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Lamination Cycles for PTH Layer
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≤3 times
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Drill-to-Board Thickness Ratio
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Maximum thickness-to-diameter ratio for plated through-hole (PTH): 20:1 (when
the cutter diameter is greater than 0.15mm)
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Hole Position Tolerance (vs CAD Data)
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±2.5mil
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PTH Hole Diameter Tolerance
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±3mil
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Press-fit Hole Diameter
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±2mil
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NPTH Hole Diameter Tolerance
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±2mil (limits +0/-2mil or +2/-0mil)
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Finished Resin-Filled Hole Size
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0.1-0.9mm (corresponding to a drilling depth of 0.15-1.0mm)
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Maximum Through-hole Aspect Ratio(Plate thickness/Drilling)
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20:01
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Track/Spacing of Resin-Filled Hole
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3/4 mil (line to line); 3/3.5 mil (line to pad, pad to pad)
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Maximum Aspect Ratio of Resin-Filled Hole(Plate thickness/Drilling)
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20:01
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Max Depth-to-Diameter Ratio (Blind Hole, Mechanical Drill)
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1.3:1 (aperture ≤ 0.20 mm), 1.15:1 (aperture ≥ 0.25 mm)
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Minimum Depth for Mechanical Back Drill
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0.1mm
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Back Drill Hole Diameter
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0.4-6.5mm
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バックドリル
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Interlayer Dielectric Thickness for Back Drilling
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≥0.15mm
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Back drill depth accuracy tolerance
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±0.075mm
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Irregularly-shaped hole
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Knife shape
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Special cutting tools: 82°, 90°, 120°, 135° (tapered hole drill bit diameter
range 0.3-10mm)
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Tapered / Step Hole Angle & Diameter
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Standard cutting tools: Angle 130° (drill diameter ≤ 3.175mm), 165° (drill
diameter 3.175-6.3mm)
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Step / Tapered Hole Angle Tolerance
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±10°
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Step / Tapered Hole Opening Diameter Tolerance
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±0.15mm
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Step / Tapered Hole Depth Tolerance
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±0.10mm
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Irregular Slot Tolerance (Routing)
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±0.10mm
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Controlled Depth Routing Accuracy (NPTH)
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±0.10mm
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Minimum Tolerance for Drilled Slots
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NPTH slot: when slot length/width ≥2, tolerance ±0.05 mm (both length & width);
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PTH slot: when slot length/width ≥2, tolerance ±0.075 mm; when 1.5 ≤ slot
length/width <2, tolerance ±0.10 mm
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Minimum Tolerance for Routed Slots
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NPTH: ±0.10 mm (slot width & length); PTH: ±0.13 mm (slot width & length)
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Minimum Pad Size (Inner / Outer Layers) for Laser Vias
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10 mil (for 4 mil laser via), 11 mil (for 5 mil laser via)
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Minimum Pad Size (Inner / Outer Layers) for Mechanical Vias
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14 mil (for 8 mil drill)
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Pad (Annular Ring)
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Minimum BGA Pad Diameter
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6mil
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Pad Diameter Tolerance
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±0.05mm
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Trace Width/Spacing
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Inner layer
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1/3oz, 1/2oz: 2.5/3.0 mil
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1oz: 3/4 mil
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2oz: 4/5 mil
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3oz: 5/8 mil
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4oz: 6.5/11 mil
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5oz: 7/13.5 mil
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6oz: 8/15.5 mil
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7oz: 9/18 mil
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8oz: 10/21mil
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outer layer
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1/3 oz: 2.5/3 mil
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1/2 oz: 3.0/3.0 mil
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1oz: 3.5/3.5 mil
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2oz: 6/7 mil
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3oz: 7/10 mil
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4oz: 8/13 mil
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5oz: 9/15.5 mil
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6oz: 10/18.5 mil
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7oz: 11/22 mil
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8oz: 12/26 mil
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Spacing Design
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Minimum Distance from Mechanical Drill to Conductor (Non Blind/Buried Via &
1st-order Laser HDI)
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5.5mil (≤8 layers), 6.5mil (10-14 layers), 7mil (>14 layers)
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Minimum Distance from Routed Board Edge to Outer Layer Trace (No Copper
Exposure)
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8mil
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V-CUT Center Line(No Exposed Copper) to Inner/Outer Layer Circuit (H = Board
Thickness)
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1.0< H ≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°)
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1.6< H ≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°)
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2.4≤H ≤3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°)
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Minimum Inner Layer Isolation Strip Width
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8mil
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Minimum Distance from Routed Board Edge to Inner Layer Trace (No Copper
Exposure)
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10mil
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Minimum Distance from Gold Finger Chamfer to TAB
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6mm
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Minimum Spacing between Vias of Same Net
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6mil (through hole), 8mil (mechanical blind via)
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Minimum Spacing between Vias of Different Nets
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12mil
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Minimum Pad Spacing (ENEPIG)
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3.5mil (corresponding to base copper of 12um and 18um)
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Minimum Spacing Between Gold Fingers
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5mil
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Minimum Spacing for HASL Pads (Without Solder Mask)
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7mil (10mil isolation between large copper pads)
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Minimum Clearance Between Blue Tape and Pads
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14mil
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Minimum Clearance Between Silkscreen and Pads
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5mil (silk screen printing), 4mil (printing process)
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Minimum Clearance Between Carbon Ink Areas
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13mil
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Embedded / Buried Copper Block PCB Design
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Copper block size
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3*3mm-70*80mm
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Copper Block Height Tolerance
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±25um
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Distance from copper block to hole wall
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≥12mil
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Buried/Blind Copper Block Thickness
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0.3-3.0mm
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High-precision PCB Basic Parameters
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Minimum thickness of inner layer
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0.05mm (non-buried blind hole plate), 0.13mm (buried blind hole drilling)
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Layer Count
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1-40 Layers
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Board thickness
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0.2-7.0mm
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Minimum finished product size
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2*2mm
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Maximum finished product size
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600*500mm (based on plate thickness)
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Interlayer alignment
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≤4mil (8 floors or less)
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Board thickness tolerance
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Board thickness≤1.0mm:±0.1mm
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Forming Design Parameters
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Impedance tolerance
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Single-ended: ±5Ω; Differential: ±5Ω
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Outline Dimension Tolerance
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±0.05mm
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Outline Position Tolerance
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0.075mm
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Maximum Warpage Capability
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0.50%
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Maximum Finished Copper Thickness (Inner/Outer Layers)
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Inner layer: 10oz; Outer layer: 20oz
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Minimum Insulation Thickness
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2mil
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Minimum Silkscreen Tracking & Height
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4 mil width / 23 mil height (12 μm, 18 μm base copper)
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Minimum Internal Corner Radius
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5 mil width / 30 mil height (35 μm base copper)
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V-CUT Angle Tolerance
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6 mil width / 45 mil height (70 μm base copper)
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V-CUT symmetry tolerance
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0.3mm
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V-CUT residual thickness tolerance
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±5°
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V-CUT board thickness
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±4mil
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PCB Forming Method
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±4mil
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Gold finger chamfer angle tolerance
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For substrates with a thickness (excluding outer copper) ≥ 0.4mm, the finished
board thickness ≤ 3.2mm. For substrates with a thickness ≤ 0.6mm, single-sided
V-cut is preferred.
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Gold finger chamfer thickness tolerance
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Milling the outline; V-cut; bridging; stamp perforation
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Solder Mask Design Parameters
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Minimum Solder Mask Bridge Width
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Base copper ≤1 oz: 4 mil (green), 5 mil (other colors), 6 mil (over large copper
areas)
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Base copper 2-4 oz: 20 mil
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Minimum Solder Mask Opening (Single Side)
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2 mil (local minimum 1.5 mil allowed)
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Minimum Distance from Solder Mask Opening to Trace
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3 mil
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Minimum Solder Mask Clearance to Non-Plated Hole
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6 mil
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Solder Mask Colors
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Green, Red, Yellow, White, Black, Blue, Purple, Matte Green, Matte Black, None
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Silkscreen Colors
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White, Black, Yellow, None
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Test parameters
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Minimum Continuity Test Resistance
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10Ω (Four-wire test: 0.3mΩ)
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Maximum Insulation Resistance
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100 MΩ
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Maximum test voltage
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300V
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