| Item | Capabilities |
|---|---|
| Layer Count | 1-12 Layers |
| Board Thickness | 4-40mil |
| Min. Board Size |
0.0788" *0.1576" (without bridge) 0.3152" * 0.3152" (with bridge) |
| Max. Board Size | 8.668" * 27.5" |
| Solder Mask Color | Green/Black/White/Red/Yellow/Transparent |
| Surface Finish | HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP, Immersion tin |
| Inner Layer Trace/ Space | 2/ 2 mil |
| Outer Layer Trace/ Space | 2/ 2 mil |
| Min. mechanical drill hole | 4 mil |
| Laser accuracy (Routing) | ±2 mil |
| Punching accuracy (Routing) | ±2 mil +6 mil |
| Impedance control tolerance | ±4Ω (≤50Ω), ±7% (>50Ω) |
| Min. coverlay bridge | 8 mil |
| Min. bend radius of single layer | 3-6 times of board thickness |
| Min. bend radius of double-layer | 7-10 times of board thickness |
| Min. bend radius of multi-layer | 10-15 times of board thickness |
| Tolerance of single layer | ±1.0mil |
| Tolerance of double-layer (≤12mil) | ±1.2mil |
| Tolerance of multi-layer (≤12mil) | ±1.2mil |
| Tolerance of multi-layer(12mil-32mil) | ±8% |
| Tolerance of board thickness (including PI stiffener) | ±10% |